When doing Signal Integrity analysis for different interfaces, our team often faces various challenges depending on many factors such as the selected topology, stackup, PCB layout, driver and receiver models. And as practice shows, not always the initial solution that was chosen by a Customer can ensure the successful operation of a real device in the future.
Firmware security of the embedded device is composed of different aspects (see the article “Secure foundation of embedded devices”). One of the secure foundation pillars that allow to drastically reduce the attack surface of the most sensitive parts of code is presented by trusted execution.
Temperature. What do we understand about its nature and influence? We can easily estimate the temperature of the surrounding air, water or even kettle without using auxiliary devices. The result of this evaluation is simple and rough: cool, comfortable, warm and hot. In most cases, we don’t even think about exact values because we don’t really care about accuracy. However, the temperature in the world of electronics means a lot on each stage of the device’s life, from creation (while soldering for example) till end usage.
The importance of security in the world of embedded electronics doesn’t really need another introduction. It’s safe to say that the world where security is not taken seriously risks turning into a world of 90s Hollywood movies where one smart kid can get full access to your phone, your traffic lights, and even your Pentagon.
The present set of news is covering the events of the industry that happened within the July timeframe.
Development of electronics comprises lots of different stages which also may require very different specializations. Between generating an idea and releasing a commercial device, companies inevitably pass through generating technical specifications, making approximate sketches, designing precise CAD projects of schematics and PCB layout, making nice 3D models of heatsinks and enclosures, and huge software development jobs. Then prototyping, testing, and setting up serial production. To say nothing of certification, packaging and shipping. Quite a job, right?
Stay tuned with the monthly news digest from EDALITY. We collect the most interesting news happened in the world of electronics and hardware design to save your time. May was full of events, but June gave us even more inputs, thus suggesting that maybe this summer will not be quiet, not at all.
There is one good question we hear from time to time from our Customers. Is it important to place decoupling capacitors close to the destination IC? The general rule of thumb says so, and every PCB designer knows it, even less experienced.
Surely enough, the main May’s newsmaker in the world of technics is SpaceX with the first in history commercial launch of a rocket having astronauts onboard. Here are some other updates from the world of electronics and hardware design you could miss.
Recently engineers of EDALITY have completed another Signal Integrity (SI) analysis assignment. As it happens often, we managed to improve the quality of high-speed interface before it became a real hardware problem.
We often use the term DFM/DFA verification while discussing with partners a development scope. Sometimes our colleagues are not fully aware of the meaning of this quality control step. Hereby we provide a short explanation of the meaning of the abbreviations DFM (Design for Manufacturability) and DFA (Design for Assembly) and elaborate on why they are so important.
“High-speed signal” is a widely used term, somehow rarely explained. Development of electronic boards with high-speed circuits requires specific knowledge and experience. Design of such PCBs means the necessity to follow the strict implicit size and spacing constraints and technology limitations that make possible to transmit accurate information on very high speed of switching a useful signal.
On March 23, 2020, SGeT group has unveiled a new specification on the latest SMARC (Smart Mobility Architecture) standard, SMARC 2.1. This is the fourth version of a highly-popular edge-type module suitable for various industrial and telecom applications.
A well-known memo reminding about the dependency of a PCB trace impedance parameter from length and cross-section of the actual line.
